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Optical External and Intrinsic Fiber Cooler for GaN Microwave Amplifier
Navy STTR FY2010.A
| Sol No.: |
Navy STTR FY2010.A |
| Topic No.: |
N10A-T017 |
| Topic Title: |
Optical External and Intrinsic Fiber Cooler for GaN Microwave Amplifier |
| Proposal No.: |
N10A-017-0534 |
| Firm: |
Photonic Systems, Inc.
900 Middlesex Turnpike
Building #5
Billerica, Massachusetts 01821 |
| Contact: |
Gary Betts |
| Phone: |
(760) 839-8211 |
| Web Site: |
www.photonicsinc.com |
| Abstract: |
In this STTR program, Photonic Systems Inc. and Prof. Jacob Khurgin at Johns Hopkins University propose novel optical external and internal fiber cooling approaches to efficiently cool the high power GaN microwave amplifier. The external cooler is a single end, square-shape, Yb:ZLAN fiber with high reflection (HR) coated surface which can attach to the amplifier surface and create a cold spot at the vicinity of the drain area where the amplifier hot spot is located. The internal Raman cooling approach, consisting of a photonic crystal resonant structure and pump-collect fiber pair, suppresses the hot optical phonon directly by using Raman scattering in GaN with resonance enhanced anti-Stokes and mitigated Stokes processes. |
| Benefits: |
The success of this program will produce high efficiency, all-solid optical cooling devices for the broad market of thermal management to modern high power semiconductor devices. It will benefit the industrial productions such as CPU, microwave amplifier, high power laser, high power photodetector, where heat conduction and thermal management will severely limit the device performance. It also specifically benefits the military applications in high power Radar, satellites, and deep space detection. The research of this program also leads to deep understanding of the fundamental physical mechanisms such as Raman scattering in the wide band gap material (GaN), interface optical phonon transport along AlGaN/GaN heterojection, and phonon ballistic transfer in nano-structures. Deep impact is expected to improve theoretical models of thermal management at nano-size devices.
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