High-rate Manufacturing of Structural-state Sensors (MOSS) Navy STTR FY2010.A Sol No.: Navy STTR FY2010.A Topic No.: N10A-T031 Topic Title: High-rate Manufacturing of Structural-state Sensors (MOSS) Proposal No.: N10A-031-0290 Firm: NextGen Aeronautics 2780 Skypark Drive Suite 400 Torrance, California 90505 Contact: Cesar delSolar Phone: (310) 626-8365 Web Site: www.nextgenaero.com Abstract: The goal of the proposed research is the development of a high-volume, low-cost manufacturing along with a novel deposition process that enables fabrication of a structural-state electronic system-on film. This hybrid electronic system contains a multifunctional sensor suite that can measure a structure's static (such as deformation, stress and strain) and dynamic state (such as slow or under acceleration). This electronic system consists of SSM patches that have been populated with sensors that have been solution-processed onto a flexible substrate. During the 7-month base Phase I effort, NextGen and UIC will develop (1) a high-volume manufacturing process, (2) a novel deposition approach for fabricated high-performance sensors, and (3) an electronic system on film. During Phase II, the design, fabrication, and testing of an array of organic strain sensors will be accomplished. Whereas in Phase I, the structural state sensing device or strain sensor was a laboratory test article, the Phase II product will be a strain sensor prototype array with more specific application performance requirements. The Technology Readiness Level (TRL) during Phase I will be elevated from a 2 to a 3. A Phase II effort would increase all three technologies to a TRL of 5. Benefits: There are several direct benefits of the proposed technologies. The high-volume low-cost manufacturing approach will provide the flexible electronics community with a methodology and case example of transferring a roll-to-roll flexible display process (i.e., a backplane of pixel drivers) to a completely different structure--i.e., a structural-state monitoring (SSM) patch. The deposition process--the judicious formulation of inks, selection of processing steps and other parameters for fabricating organic and inorganic SSM sensors in high volume--will also benefit the printable electronics community by supplying users with deposition process steps suitable for high-volume low-cost sensor printing and packaging. In addition to the manufacturing methodology and novel process procedures, the resulting sensor package is of significant benefit to the advanced aerospace community, an especially enabling technology for cognitive aircraft. SSM using flexible electronics provides the necessary low-cost conformability and functionality necessary to revolution Unmanned Aerial Vehicles (UAVs). If only UAVs could be made "cognitive" or more specifically, highly sensitive, highly efficient, highly maneuverable, and highly flexible (such as in morphing UAVs and flapping wings) the next epic in aircraft design would materialize. SSM using flexible electronics endows UAVs with the technology it needs to make this next leap. Return