High-Speed Method to Produce Flexible Pressure Sensors Navy STTR FY2010.A Sol No.: Navy STTR FY2010.A Topic No.: N10A-T031 Topic Title: High-Speed Method to Produce Flexible Pressure Sensors Proposal No.: N10A-031-0630 Firm: Applied Nanotech, Inc. 3006 Longhorn Blvd. Suite 107 Austin, Texas 78758-7631 Contact: James Novak Phone: (512) 339-5020 Web Site: www.appliednanotech.net Abstract: The promise of printed electronics can not be realized without high-speed manufacturing processes to drive the cost down for wide spread distribution. This proposal will outline the key points for rapid manufacturing of new electronic devices and systems and make recommendations for making them a reality. There are two main focus areas that encompass all the limitations to printed integrated circuits: (1) the materials issues of developing the optimal active semiconductor and conductive circuit connections and (2) the fabrication methods and material / substrate interactions that achieve the desired performance, print speed and provide robustness of the final product. ANI will utilize its high-quality nanoparticle based inks for high-speed production of an active electronic device. The concept entails using a state-of-the-art nanoparticle inks for electrical contact lines, soluble organic semiconductors and printable dielectrics all applied using high-speed ink-jet technologies. Benefits: Successful completion of this STTR two-phase program will result in a new materials and the processes for application using high-speed techniques. While the solicitation specifically targets high-rate manufacturing, we anticipate that this technology can not be widely realized without materials development for all aspects of circuit design. A market already exists for printed electronics; the creation of new materials for high-speed production improves an already existing product offering and expands the market opportunities to such applications as Printed Batteries, Printed Displays, Memory, Medical Disposables, Large Area Electronics, Lasers, Microphones, Loudspeakers, Solar Cells, Sensors, Low voltage applications (power consumption), Individual Unique Devices - Security enabled, and Ultra-sensitive Sensors. The U.S. demand for EMI/RFI shielding product technologies was estimated to approach $8 billion in 2013. The high-speed processing developed in this STTR would drive down the cost of printed electronics to result in new application areas for both military and consumer markets. Return