Reworkable Epoxy Bonding for Superconductor Multi-chip Modules Navy STTR FY2012.A Sol No.: Navy STTR FY2012.A Topic No.: N12A-T014 Topic Title: Reworkable Epoxy Bonding for Superconductor Multi-chip Modules Proposal No.: N12A-014-0258 Firm: HYPRES. Inc. 175 Clearbrook Road Elmsford, New York 10523 Contact: Deepnarayan Gupta Phone: (914) 592-1190 Web Site: www.hypres.com Abstract: HYPRES, in collaboration with University of Arkansas (UA), proposes to develop a method for manufacturing superconductor multi-chip modules (MCMs) using nano-engineered cryogenic adhesives. A superconductor MCM comprises a carrier and several flipped chips. Before final assembly on the carrier, these chips need to be screened by temporarily attaching each one to another carrier with active test circuitry. Therefore, a detachable die attachment process is needed for selecting a set of known good die. In Phase I, a set of active carriers will be fabricated and qualified by testing along with a set of chips for mounting on them. The best composition of the adhesive will be obtained by conducting a series of experiments on adhesion strength, thermal and electrical conductivity, and removal without damage to the carrier and the chip. This will provide a platform for developing a two-chip MCM, with chips such as analog-to-digital converters flipped on top of a carrier with digital circuitry, during the Phase I option period in preparation for more complex MCMs. Benefits: The proposed technology for reworkable epoxy bonding is expected to unleash the full potential of superconductor digital electronics. So far, the size, weight, power consumption and cost of the cryogenic infrastructure had limited the field of application for superconductor digital systems built with single integrated circuit chips. The addressable market for superconductor electronics will greatly expand by enhancing the complexity of superconductor digital systems through multi-chip integration. Scaling complexity by an order of magnitude will be a far better match for the existing small-scale cryocoolers and enable a number of applications, such as Navy's shipboard multi-band, multi-function radio frequency systems. Even greater benefits will follow in future through further scaling up to large-scale systems such as high-end computers and network switches since the cryocoolers become increasingly more efficient in terms of power consumption and cost. Return