Multi-Chip Module Maturation, Whole Wafer testing, and Reworkable Epoxy Bonding Navy STTR FY2012.A Sol No.: Navy STTR FY2012.A Topic No.: N12A-T014 Topic Title: Multi-Chip Module Maturation, Whole Wafer testing, and Reworkable Epoxy Bonding Proposal No.: N12A-014-0071 Firm: Space Micro Inc. 10237 Flanders Court San Diego, California 92121-1526 Contact: Carl Edwards Phone: (858) 332-0700 Web Site: http://www.spacemicro.com/ Abstract: The Navy is looking for a novel way to "test the functionality automatically of all the die on a wafer before it is diced to find the working die and then to mount the "known-good" die into a larger circuit in such a way that repair to the functionality of the whole can be accomplished by replacing the part, not the whole." The enabling technology is a reworkable adhesive with a combination of properties; reworkability, cryogenic (4K) thermal conductivity, removability without residue, and full processing below 125C. This is desirable for testing complex but immature circuits as "known good die" prior to committing them to a permanent and expensive assembly step. The team of Space Micro Inc. and XXXXXXXXX has deep expertise in die attachment, high frequency testing and materials development will leverage that resident expertise and test capability to develop this technology. Benefits: A demonstrated solution developed in this STTR will have applications in both a military and non-military markets to include commercial aircraft and satellite markets, and others. The military applications include various launch vehicle boosters, strategic missile systems, satellites, and UAVs/HAAs. Space Micro has prior experience working with DoD, primarily Air Force to date, has demonstrated its ability to transition this technology into the field. Our initial commercialization efforts during the STTR Phase II will focus on U.S. DoD applications for Navy and related programs within the DoD, as well as conducting marketing presentations explaining the merits of our technology Return