Gallium Nitride Based Active Electronically Scanned Array (AESA) Technology for High Altitude Periscope Detection Navy SBIR FY2013.2 Sol No.: Navy SBIR FY2013.2 Topic No.: N132-095 Topic Title: Gallium Nitride Based Active Electronically Scanned Array (AESA) Technology for High Altitude Periscope Detection Proposal No.: N132-095-0064 Firm: CUSTOM MMIC DESIGN SERVICES INC 1 Park Drive Unit 12 Westford, Massachusetts 01886-3535 Contact: Paul Blount Phone: (978) 467-4290 Web Site: www.custommmic.com Abstract: In this proposal, we consider GaN Monolithic Microwave Integrated Circuit (MMIC) Technologies to enable a low cost, high performance, thin, efficient, low size, weight and power (SWaP), Active Electronically Scanned Array (AESA) Radar for high altitude submarine periscope detection. MMIC technology combines and integrates AESA functions into smaller footprints when compared to using separate package parts for each function. MMICs to be developed include single integrated Gallium Nitride (GaN) transmit and receive (T/R) modules that reside on the array face. This technology will lead to efficient and effective introduction of high altitude Anti-Submarine Warfare (ASW) capability into the MQ-8 (B&C) Fire Scout maritime Intelligence, Surveillance, and Reconnaissance (ISR) mission. Developed under the contract will be GaN power amplifiers, switches, and low noise amplifiers. We will also perform a foundry analysis to determine the best GaN process for performance, cost, and reliability. Decision will also be made on whether a single multi-function MMIC or a multi-MMIC package will generate the best combination of performance and versatility, especially when upgrading single sections. Finally the package itself will be re-engineered for a new design that combines exceptional RF performance with optimal heat removal. Benefits: The chipset will be directly applicable to other commercial radar programs in the C-band rea. Also, single function variants of the components (PA, LNA, Switch) will be available for sale into other commercial C-band systems including communication systems. The packaging technology developed will influence system design and integration for years to come. Return