Miniaturized Integrated Power Combiner Navy SBIR FY2016.1 Sol No.: Navy SBIR FY2016.1 Topic No.: N161-031 Topic Title: Miniaturized Integrated Power Combiner Proposal No.: N161-031-0188 Firm: Omega Micro Technologies, Inc. 3495 Kent Avenue, Suite M100 West Lafayette, Indiana 47906 Contact: Joel Derby Phone: (765) 775-1011 Web Site: http://www.omegamicrotech.com Abstract: A critical element in higher power systems such as T/R modules, communication transmitters, and EW modules, is power combiners. To obtain the necessary output power, systems typically require multiple combined power amplifiers. Various options are available, however, the trade-offs between options must be fully understood. Couplers based on planar structures or 2.5 dimensional designs are readily available either as custom designed circuits within the substrate, or as components. Another option depending upon the frequency band of operation, are waveguide or spatial based combiners. Trade-offs that must be taken into account include size, weight, insertion loss, bandwidth, power handling capacity, and size. There is a tremendous need for the development of low loss, small form factor, low cost, higher power combiners that can be integrated into a system's substrate or procured as a component. Omega Micro Technologies will leverage their expertise in the field of RF and microwave substrate design and fabrication to produce an innovative, high power combiner technology integrated into a low-temperature co-fired ceramic substrate yielding an optimum balance of design parameters. Multiple coupler topologies will be developed such that a broad range of frequencies, bandwidths, and output power can be supported. Benefits: This effort is a natural extension of Omega's core business of LTCC and thick-film substrate fabrication for military, space, commercial, and aerospace applications. While the initial MIPC will focus primarily on the U.S. Navy's current expressed need, the project will evaluate the various topologies and compile a table / cross reference of the various designs and their attributes. While Omega's goal would be to insert the developed MIPC into a customer's existing substrate and to have the opportunity to compete on the fabrication of the entire substrate, other potential insertions of the technology would be through the licensing of the design(s) or the production of standalone combiners at the component level. Following the development of the MIPC for the U.S. Navy's initial application, the overall MIPC designs will find a multitude of additional opportunities within U.S. Navy programs as well as the other branches of the DoD supporting next generation as well as existing electronic equipment as radars, electronic warfare (EW), electronic counter measures (ECM), and communication systems. Return