Shaped Radome and Embedded Frequency Selective Surface Modeling for Large-Scale Platforms Navy SBIR FY2016.1 Sol No.: Navy SBIR FY2016.1 Topic No.: N161-022 Topic Title: Shaped Radome and Embedded Frequency Selective Surface Modeling for Large-Scale Platforms Proposal No.: N161-022-0698 Firm: HyPerComp, Inc. 2629 Townsgate Road Suite 105 Westlake Village, California 91361 Contact: vijaya shankar Phone: (805) 371-7556 Web Site: http://www.hypercomp.net Abstract: The primary focus of this SBIR effort is to further develop the state of the art frequency domain electromagnetic solver ParMax based on the UWVF formulation, specifically with regard to rapid performance analysis of complex radome designs. In addition, this development will meet the following requirements:  The method is contributing to new ideas and innovations in the area of volumetric Boundary Integral Equation (BIE) solvers,  Demonstrate high order accuracy and an order of magnitude reduction in computational resource requirements over the current CEM state of the art and state of practice,  Be able to handle different CAD models (IGES, STEP, Parasolid, STL, and SAT) for both the platform and the radome, including several antennas mounted on the platform,  Be able to handle problem sizes in the 500-1000??range involving antenna/radome/structure interaction on full scale targets,  Be able to run Navy's problems of interest on moderate size clusters (512 cores), and  Software architecture to include both CPU and GPU clusters, and other emerging platforms such as the Intel MIC architecture. Benefits: In addition to serving the vital interests of the DoD, the development of an electromagnetic solver for electrically large problems will be well suited for a number of commercial applications involving EM simulations. Some of these include patient-specific hyperthermia radiation treatment for cancer, study of long term radiation effects from cellular phones, the sensitivity of cellular phones to various positions in a metropolitan area, hazards from high power lines near residential areas, meeting the EMC specifications of high power microwave circuits, and modeling of waveguide problems. The advancements to be made in quick-turnaround parallel processing using PC-based computing will significantly leverage any commercialization efforts. Return