Nanostructured High Frequency 3-D Coaxial Interposer Array Navy SBIR FY2006.2 Sol No.: Navy SBIR FY2006.2 Topic No.: N06-120 Topic Title: Nanostructured High Frequency 3-D Coaxial Interposer Array Proposal No.: N062-120-0539 Firm: Synergistic Advanced Technologies LLC 8987 East Tanque Verde Road, Suite 292B Tucson, Arizona 85749 Contact: Thomas Venable Phone: (520) 760-0291 Abstract: This Navy Small Business Innovation Research Phase I project provides an 80% package size reduction, reliability improvement and dramatic cost reduction of semiconductor linear amplifier packages and assemblies, while providing signal integrity beyond 10 gigahertz. Our research and development project will demonstrate 3-D coaxial, low inductance, nanostructured integrated passive capacitor arrays to provide several performance solutions, functionality improvements, quality improvement (by eliminating fractures), and an 80% reduction in the size of semiconductor circuit blocks. Our research entails formulation and processing of nanostructured multilayer barium titanate dielectrics and design of innovative miniaturized, low inductance, coaxial integrated passive capacitor interposer arrays to provide decoupling, bypassing and reservoir energy storage, while eliminating the effects of electromagnetic interference (EMI) noise. This family of integrated interposer arrays is inserted underneath the semiconductor chip and provides coaxial output for each input/output (I/O) and thus eliminates the need to fan out circuit board traces for mounting individual bypass, decoupling and reservoir energy storage capacitors. This nanostructured capacitor array will operate from DC through 10 gigahertz. Our R & D project will result in immediate market applications in military, industrial and consumer products. Benefits: What is the Broader Impact of our Project? In 1965, Intel co-founder Gordon Moore saw the future. His prediction, popularly known as Moore's Law, states that the number of transistors on a chip doubles about every two years. This observation about silicon integration, made a reality by Intel and other semiconductor manufacturers, has fueled the worldwide technology revolution. Synergistic Advanced Technologies will provide another fundamental step along this path to integrate and continue the miniaturization, performance improvement and cost reduction quest. Our novel, 3-D coaxial, low inductance, radio frequency, nanostructured integrated passive capacitor arrays, require multidisciplinary skills and imagination in: materials research, electronic circuit design, electronic packaging design, and EMI and EMC shielding technology. Our Project Team leader, Tom Venable, Principal Investigator, has extensive successful experience in establishing and commercializing multilayer ceramic capacitor and EMI filtered connector arrays, and, he is supported by an excellent team. The market size projection for these devices will exceed more than $65 million per year and, depending on acceptance in the auto industry, will grow well beyond $300 million per year. Return