Intelligent, Fault Tolerant and Robust Silicon Carbide based Power Management Unit for Aircraft Applications
Navy SBIR FY2010.3


Sol No.: Navy SBIR FY2010.3
Topic No.: N103-203
Topic Title: Intelligent, Fault Tolerant and Robust Silicon Carbide based Power Management Unit for Aircraft Applications
Proposal No.: N103-203-0197
Firm: Arkansas Power Electronics International, Inc.
535 W. Research Center Blvd., Suite 209
Fayetteville, Arkansas 72701
Contact: Roberto Schupbach
Phone: (479) 443-5759
Web Site: www.apei.net
Abstract: In this proposed program, the APEI team will design, build, and test a multi-channel fully-integrated, high-temperature (250 �C), high speed (< 100 �s), SiC-based SSPD demonstrator by the end of the program. The proposed SiC-based SSPD will combine APEI, Inc.'s advanced high temperature power packaging technology (which will be capable of operating at junction temperatures in excess of 250 �C) with the latest SiC devices in order to develop a SSPD that follows a system architecture and vision provided by our strategic partner.
Benefits: The level of control and responsiveness expected from future protection devices requires the replacement of electro-mechanical approaches by new approaches that make use of solid state electronics. There are many different types of solid-state based protection devices commercially available today. Those protection devices, however, are not capable of meeting the power, current and voltage rating of the future MEA systems. One of the factors limiting the scalability of those protection devices is the limited ruggedness and thermal performance of the silicon (Si) devices used as the main power interruption element. Present high power solid-state based protection technology requires active cooling in order to sustain the environmental conditions of emerging More Electric / All Electric Aircraft (MEA/AEA) concepts. Active cooling imposes a weight penalty because of the ducting, plumbing, heatsinks, and extra ECS (Environmental Control System) capacity required. A solid-state protection device requiring only passive cooling, as proposed by this team, will not only increase design flexibility and simplify integration, but will also enhance reliability.

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