| Sol No.: |
Navy SBIR FY2013.1 |
| Topic No.: |
N131-031 |
| Topic Title: |
Low Cost/High Performance TR Module Packaging Technologies |
| Proposal No.: |
N131-031-0379 |
| Firm: |
Nuvotronics LLC
7586 Old Peppers Ferry Loop
Radford, Virginia 24141-8846 |
| Contact: |
Jim MacDonald |
| Phone: |
(800) 341-2333 |
| Web Site: |
www.nuvotronics.com |
| Abstract: |
Nuvotronics proposes to develop low-cost/high performance module technology for application in next generation TR modules. A near-hermetic approach using a four-step sealing approach is used, along with additional cost-savings realized in module interconnects and use of COTS components. A goal of 50% cost savings over today's module is proposed. Phase I will provide environmental testing of a high-power test article that demonstrates key aspects of our approach. |
| Benefits: |
The program leverages previous work done under SBIR funding in a low-risk but high value demonstration of new packaging capabilities. |