Low Cost/High Performance TR Module Packaging Technologies
Navy SBIR FY2013.1

Sol No.: Navy SBIR FY2013.1
Topic No.: N131-031
Topic Title: Low Cost/High Performance TR Module Packaging Technologies
Proposal No.: N131-031-0379
Firm: Nuvotronics LLC
7586 Old Peppers Ferry Loop
Radford, Virginia 24141-8846
Contact: Jim MacDonald
Phone: (800) 341-2333
Web Site: www.nuvotronics.com
Abstract: Nuvotronics proposes to develop low-cost/high performance module technology for application in next generation TR modules. A near-hermetic approach using a four-step sealing approach is used, along with additional cost-savings realized in module interconnects and use of COTS components. A goal of 50% cost savings over today's module is proposed. Phase I will provide environmental testing of a high-power test article that demonstrates key aspects of our approach.
Benefits: The program leverages previous work done under SBIR funding in a low-risk but high value demonstration of new packaging capabilities.