Thermal Management Improvements for Transmit/Receive Modules
Navy SBIR FY2013.1

Sol No.: Navy SBIR FY2013.1
Topic No.: N131-028
Topic Title: Thermal Management Improvements for Transmit/Receive Modules
Proposal No.: N131-028-0037
Firm: Advanced Cooling Technologies, Inc.
1046 New Holland Avenue
Lancaster, Pennsylvania 17601-5688
Contact: Richard Bonner
Phone: (717) 295-6105
Web Site:
Abstract: This Small Business Innovation Research (SBIR) Phase I project will develop and demonstrate a thermal ground plane (TGP) technology with improved manufacturability and reliability over previous technology generations. Advanced Cooling Technologies, Inc. is developing ultra low thermal resistance and high heat flux wick structures to improve thermal performance in TGP's used to cool electronic systems. The advanced TGP's further consist of ceramic materials with coefficients thermal of expansion (CTE's) closely matching those common semiconductor materials. The CTE matching feature allows the TGP to be soldered directly to the semiconductor device using standard manufacturing practices, which helps to minimize the thermal interface resistance between the TGP and the semiconductor device.
Benefits: The public can only reap the benefits of the proposed technology though the commercialization and transition of the technology to the Navy and other programs. The successful transition of the advanced TGP's will allow critical Navy programs to operate their devices at higher powers and power densities, which will increase the capability and scope of their missions. In commercial applications, such as computer servers, the enhanced cooling provided by these TGP's will increase the speed, improve the reliability, and reduce the energy consumption required to keep the servers cool.