TECHNOLOGY AREAS: Air Platform, Materials/Processes

ACQUISITION PROGRAM: PMA-261, H-53 Helicopters

OBJECTIVE: Develop an advanced heat gun/soldering iron compatible with leaded and lead-free solders without risk of cross-contamination and all approved heat shrink and solder sleeves for use in a Navy flight-line maintenance environment.

DESCRIPTION: With the introduction of restrictions on hazardous substances, Navy aircraft now have to contend with both leaded and lead-free solder applications within a single platform. Significant amounts of solder repairs are performed on aircraft for solder cup contacts within connectors, hook and solder relays, and other electrical components outside of box level repair. Cross-contamination of solder types is a major concern as it leads to premature solder joint fatigue and alters solder temperature profiles. Additionally, solder repair may require heat shrinkable products applied over the repair, necessitating the use of additional support equipment. There is currently no heating tool that can operate as both a heat gun and soldering iron capable of leaded and lead-free application with the risk of cross contamination. A non-contact method would ideally eliminate contamination risks. However, such a tool capable of performing operations on approved leaded and lead-free solder in an on-aircraft environment currently does not exist. Alternately, a contact method incorporating self-cleaning or rapid reconfiguration for different solder types and temperatures may meet objectives. The only heat guns rated for on-aircraft use are cumbersome requiring both compressed air/nitrogen bottles and external electrical power. Alternatively, they are battery operated and have limited heating and operating time capability. Secondary to temperature control and solder method, tool operation time under a range of temperatures and operating modes will be crucial for successful tool implementation.

An advanced heating gun/soldering iron is sought that incorporates the following properties: compact and portable; lightweight; rated for on-aircraft use, i.e., will meet explosive atmosphere (see MIL-STD-810) and electromagnetic interference requirements (see MIL-STD-461/464 requirements); self-contained power storage/generation for on-aircraft use; capable of accepting input power on 110-240 volts, 50, 60 or 400 Hz for bench work and recharging if electrical power is needed; adjustable heat output for accommodating varying ambient temperature environments, soldering, de-soldering, shrink sleeve, and solder sleeve requirements; capable of soldering with both lead and lead free solders. A non-contact or isolated soldering method is preferred to prevent contamination from lead and/or lead free solders.

PHASE I: Determine the feasibility of developing a heat gun/soldering iron that incorporates the properties described above. Develop a functional prototype and provide test data.

PHASE II: Design, develop, and demonstrate the heat gun/soldering technology operability in the relevant environment. Conduct testing to demonstrate capabilities.

PHASE III: Prepare heat gun/soldering samples for qualification testing and submit to qualifying activity.

PRIVATE SECTOR COMMERCIAL POTENTIAL/DUAL-USE APPLICATIONS: The issues of heat gun/soldering tool operation on aircraft are common to both the commercial and military sectors. In addition, ships, submarines, and other applications using aerospace-type heat gun/soldering have the same wire repair issues.

REFERENCES:
1. NAVAIR 01-1A-505-1, Work Package 12, Heating Tools Installation and Repair Practices for Aircraft Electric and Electronic Wiring.

2. NAVAIR 01-1A-505-1, Work Package 16, Soldering Installation and Repair Practices for Aircraft Electric and Electronic Wiring.

3. IR laser diode soldering,
http://www.emasiamag.com/article-2639-diodelasersystemsnextgenerationnoncontactsolderingtechnology-Asia.html

4. Ultrasonic soldering,
http://www.assemblymag.com/Articles/Feature_Article/BNP_GUID_9-5-2006_A_10000000000000290887

KEYWORDS: Wiring; Heat Gun; Soldering Iron; Support Equipment; Aircraft; Electrical

** TOPIC AUTHOR (TPOC) **

DoD Notice:   Between November 12 and December 7, 2008, you may talk directly with the Topic Authors to ask technical questions about the topics. Their contact information is listed above. For reasons of competitive fairness, direct communication between proposers and topic authors is not allowed starting December 8, 2008, when DoD begins accepting proposals for this solicitation.

However, proposers may still submit written questions about solicitation topics through the DoD's SBIR/STTR Interactive Topic Information System (SITIS), in which the questioner and respondent remain anonymous and all questions and answers are posted electronically for general viewing until the solicitation closes. All proposers are advised to monitor SITIS (09.1 Q&A) during the solicitation period for questions and answers, and other significant information, relevant to the SBIR 09.1 topic under which they are proposing.

If you have general questions about DoD SBIR program, please contact the DoD SBIR Help Desk at (866) 724-7457 or email weblink.