N093-212 TITLE: Non-Hermetic Passivation/Coating Processes with Integrated Electromagnetic Protection

TECHNOLOGY AREAS: Materials/Processes, Sensors

ACQUISITION PROGRAM: NON-ACAT X-Band and S-Band Radars and EW Arrays

OBJECTIVE: Develop innovative Monolithic Microwave Integrated Circuit (MMIC) and circuit passivations and coatings that protect circuits from shipboard Phased Array Radar/Electronic Warfare (EW) Electronically Steered Arrays (ESAs) electromagnetic environments in addition to providing environmental protection.

DESCRIPTION: Passivation technologies that provide robust non-hermetic packaging and environmental protection of Transmit/Receive (T/R) module electronic circuits and MMICs have been demonstrated. This reduces  T/R module assembly cost and helps enable affordable electronic steered arrays for Radar and EW applications. These passivation processes provide environmental protection but they do not protect the MMIC and T/R module circuit from shipboard and array level electromagnetic interference (EMI.) This currently requires metalized lids and electrical interference protection to be added to the T/R module assemblies which requires additional cost and creates potential for reliability issues of the modules. This topic seeks innovative approaches which would mitigate the need for additional lids and external RF interference protection. The incorporation of metal coatings, to provide EMI protection, can also negatively impact circuit performance. The technology of interest would provide EMI protection and environmental protection without degrading the electrical performance of the protected T/R module circuit while still focusing on affordability as a major performance issue.

PHASE I: Design, model, and/or evaluate integrated EMI protection non-hermetic packaging techniques meeting the intent of this topic. The metrics for success are: (a) no degradation of electrical performance (gain, current consumption, input/output impedance, S-parameters) and (b) maintenance of environmental EMI and moisture ingress/absorption protection while reducing the overall module assembly complexity and cost by 20 percent.

PHASE II: Develop manufacturing processes and build prototype test vehicle with the coatings, passivations, and encapsulations selected from Phase I. Demonstrate stable MMIC/ T/R module electrical performance over anticipate shipboard operational temperature and moisture ranges and meet, or exceed this topics stated objectives. Demonstrate critical new manufacturing processes and  test hardware performance  that establish feasibility of the developed technologies and manufacturing processes  to provide production non-hermetic T/R Modules that do not require additional metalized lids to function in a shipboard RF environment. In addition, conduct preliminary cost modeling to show that the developed technology is cost competitive with current State of the Art (SOA) T/R module production processes.

PHASE III: Establish manufacturing processes and quality controls to provide production quality materials, coatings, passivations, encapsulates integrated onto T/R modules of interest to IWS Radar and EW applications.  Manufacture T/R modules to demonstrate final processes and conduct electrical and environmental performance testing of the contractor's technology. Conduct cost modeling to show that the developed technology is cost competitive with current State of the Art (SOA) T/R module production processes.

PRIVATE SECTOR COMMERCIAL POTENTIAL/DUAL-USE APPLICATIONS: Coatings, passivations and encapsulation technologies that can provide environmental protection in addition to Electromagnetic Interference (EMI) protection with minimal electrical performance degradation will have applications in commercial industries as well as on numerous military systems.

REFERENCES:
1. "GaAs MMIC Reliability Assurance Guideline for Space Applications", S. Kayali, G. Ponchak, R.Shaw, JPL Publication 96-25.

2. Bahl, I., and P. Bhartia, Microwave Solid State Circuit Design, John Wiley &Sons, Inc., New York, 1988.

3. "WASPP Program: Advanced Passivation for Advanced Packages and Harsh Environments", Reusnow, C.; Wheelock, S., Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on Volume, Issue, 2001 Page(s):63 �67

KEYWORDS: Non-hermetic packaging; MMIC passivation; circuit board encapsulations and coatings; Transmit/Receive Modules; GaAs; GaN; X-band; S-band; Radar; EW; EMI;RF

** TOPIC AUTHOR (TPOC) **

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