Miniature Diode-Pumped Solid State Laser for Military and Aerospace Environments
Navy SBIR 2019.1 - Topic N191-010
NAVAIR - Ms. Donna Attick - firstname.lastname@example.org
Opens: January 8, 2019 - Closes: February 6, 2019 (8:00 PM ET)
AREA(S): Air Platform, Electronics
PROGRAM: JSF Joint Strike Fighter
technology within this topic is restricted under the International Traffic in
Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and
import of defense-related material and services, including export of sensitive
technical data, or the Export Administration Regulation (EAR), 15 CFR Parts
730-774, which controls dual use items. Offerors must disclose any proposed use
of foreign nationals (FNs), their country(ies) of origin, the type of visa or
work permit possessed, and the statement of work (SOW) tasks intended for
accomplishment by the FN(s) in accordance with section 3.5 of the Announcement.
Offerors are advised foreign nationals proposed to perform on this topic may be
restricted due to the technical data under US Export Control Laws.
Develop and package fiber pigtailed high-power diode-pumped solid state lasers,
operating at 1.55, 1.06, and 1.32 micron wavelengths, for wideband Radio
Frequency (RF) photonics applications.
Current airborne military communications and electronic warfare systems require
ever-increasing bandwidths while simultaneously requiring reductions in space,
weight, and power (SWaP). The replacement of the coaxial cable used in various
onboard RF/analog applications with RF/analog fiber optic links will provide
increased immunity to electromagnetic interference, reduction in size and
weight, and an increase in bandwidth. However, for some airborne platform
applications, RF/analog fiber optic links require the development of shot noise
limited lasers that can operate over extended temperature ranges (-40 to
I: Design and analyze the proposed approach for 1.55 micron lasers. Demonstrate
feasibility of 1.55-micron laser power with a supporting proof of principle
bench top experiment showing path to meeting Phase II goals. Design and analyze
a laser package prototype. The Phase I effort will include prototype plans to
be developed under Phase II.
II: Optimize the 1.55-micron single-longitudinal-mode laser and packaged laser
designs from Phase I. Build and test the laser to meet design specifications.
Test the prototype in an RF photonic link with the minimum performance levels
reached. Characterize the packaged laser transmitter over temperature and air platform
thermal shock, temperature cycling, vibration, and mechanical shock spectrum.
If necessary, perform root-cause analysis and remediate laser package failures.
Deliver 1.55-micron laser packaged prototype. Design and analyze the
applicability of the proposed approach to the other desired wavelengths and
longitudinal mode options.
III DUAL USE APPLICATIONS: Finalize and transition the packaged laser prototype
into manufacturing, potentially with a U.S.-based photonic component supplier,
making the component available to the public and defense industry. Commercial
applications include wireless networks based on remoted antennas used in
commercial telecommunication systems.
Beranek, M. and Copeland, E. “Accelerating Fiber Optic and Photonic Device
Technology Transition via Pre-qualification Reliability and Packaging
Durability Testing.” IEEE Avionics and Vehicle Fiber-Optics and Photonics
Conference: Santa Barbara, 2015. https://ieeexplore.ieee.org/document/7356630/
Urick, V., Mckinney, J. and Williams, J. “Fundamentals in Microwave Photonics”
John Wiley & Sons, Inc.: Hoboken, 2015, pp. 469-472.
MIL-STD-38534J, General Specification for Hybrid Microcircuits. http://www.landandmaritime.dla.mil/programs/milspec/ListDocs.aspx?BasicDoc=MIL-PRF-38534
MIL-STD-810G, Environmental Engineering Considerations and Laboratory Tests. http://everyspec.com/MIL-STD/MIL-STD-0800-0899/MIL-STD-810G_12306/
MIL-STD-883K, DoD Test Method Standard Microcircuits. http://www.dscc.dla.mil/downloads/milspec/docs/mil-std-883/std883.pdf
Laser; Diode-Pumped; Solid State; RF-Over-Fiber; Fiber Optics; Packaging; Radio